Physical origin of residual thermal stresses in a multilayer ceramic capacitor

Shin, H and Park, JS and Hong, KS and Jung, HS and Lee, JK and Rhee, KY (2007) Physical origin of residual thermal stresses in a multilayer ceramic capacitor. Journal of Applied Physics, 101 (6). ISSN 0021-8979

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Abstract

The physical origin of the residual stresses developed in the ceramic layer of the active region in a multilayer ceramic capacitor was numerically investigated. The compressive in-plane stress components σ11 and σ22 originate without regard to the presence of the margins but rather from the difference in in-plane thermal shrinkage between ceramic and metal electrode. The out-of-plane stress component σ33 physically originates mainly through the presence of the housing margin; the presence of the lateral margin is a minor source: the more ceramic-rich margins hinder the apparent vertical shrinkage of the active region to yield tensile σ33. © 2007 American Institute of Physics.

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Details

Item Type:	Article
Status:	Published
Creators/Authors:	Creators Email Pitt Username ORCID Shin, H Park, JS Hong, KS Jung, HS Lee, JK jul37@pitt.edu JUL37 0000-0002-7778-7679 Rhee, KY
Centers:	Other Centers, Institutes, Offices, or Units > Petersen Institute of NanoScience and Engineering
Date:	8 April 2007
Date Type:	Publication
Journal or Publication Title:	Journal of Applied Physics
Volume:	101
Number:	6
DOI or Unique Handle:	10.1063/1.2713364
Schools and Programs:	Swanson School of Engineering > Mechanical Engineering and Materials Science
Refereed:	Yes
ISSN:	0021-8979
Date Deposited:	05 Nov 2014 20:47
Last Modified:	22 Jun 2021 20:55
URI:	http://d-scholarship.pitt.edu/id/eprint/23452

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