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Ultrafast Laser Fabrication of 3-D Photonic Components and Photonic Topological Insulators

Huang, Sheng (2019) Ultrafast Laser Fabrication of 3-D Photonic Components and Photonic Topological Insulators. Doctoral Dissertation, University of Pittsburgh. (Unpublished)

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Abstract

Optical waveguide interconnect has been considered as a key enabling technology to address bandwidth bottleneck limited by electrical wire at board levels. Current waveguide technology for optical interconnect were realized based on 2D waveguide technology based on layer-by-layer lithography schemes built on silicon or polymer substrates. As data rate explodes at chip and board levels, the optical routing complexity and high laser power required to support high data bandwidth demand a new waveguide interconnect topology.
In this dissertation, we study and explore ultrafast laser fabrication technology to build highly complex 3D waveguide lightwave circuits in glass substrates to support demand for high bandwidth optical interconnect. This dissertation first explores 3D waveguide structure fabrication in flexible glass substrates. Characteristics and performances of various waveguide devices inscribed in flexible glasses are compared with those built on polymer substrates. This work is then followed by development of an integrated laser manufacturing solution, using the same platform, to manufacture board-level optical interconnect waveguides and 45° total internal reflection (TIR) micromirror for vertical coupling. To expand 3D waveguide technology in optical fiber devices, 3D waveguide couplers and WDM components, two key components for fiber lasers, were directly fabricated on multi-core optical fibers, turning the silica fiber from a 1-D optical channel to a 3-D integrated system. Based on paraxial approximation, 3D coupled photonic waveguide array were designed, fabricated, and characterized to study photonic graphene under Gauge field. Results and efforts described in this dissertation demonstrated that, through the optimization of laser matter interaction, high-density 3D waveguide consists of more than 15 layer can be fabricated for a wide array of photonic applications.


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Details

Item Type: University of Pittsburgh ETD
Status: Unpublished
Creators/Authors:
CreatorsEmailPitt UsernameORCID
Huang, Shengshh67@pitt.edushh67
ETD Committee:
TitleMemberEmail AddressPitt UsernameORCID
Committee ChairChen, Kevinpec9@pitt.edupec9
Committee MemberMao, Zhi-Hongzhm4@pitt.eduzhm4
Committee MemberTan, Sushengsut6@pitt.edusut6
Committee MemberXiong, Fengf.xiong@pitt.eduf.xiong
Committee MemberOhodnicki, PaulPaul.Ohodnicki@NETL.DOE.GOVpro8
Date: 24 January 2019
Date Type: Publication
Defense Date: 30 November 2018
Approval Date: 24 January 2019
Submission Date: 3 December 2018
Access Restriction: 3 year -- Restrict access to University of Pittsburgh for a period of 3 years.
Number of Pages: 120
Institution: University of Pittsburgh
Schools and Programs: Swanson School of Engineering > Electrical and Computer Engineering
Degree: PhD - Doctor of Philosophy
Thesis Type: Doctoral Dissertation
Refereed: Yes
Uncontrolled Keywords: Laser material processing, imaging processing, wave simulation, laser written waveguide
Date Deposited: 24 Jan 2020 06:00
Last Modified: 24 Jan 2020 06:00
URI: http://d-scholarship.pitt.edu/id/eprint/35693

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