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Suppression of Dewetting in Pulsed Laser Melting of Thin Metallic Films on Silica

Kline, James Eric (2005) Suppression of Dewetting in Pulsed Laser Melting of Thin Metallic Films on Silica. Master's Thesis, University of Pittsburgh. (Unpublished)

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Pulsed excimer laser projection irradiation has been successfully applied to completely melt and resolidify encapsulated elemental metal films of Au, Cu, Cr, and Ni directly on amorphous SiO2 substrates. A combination of narrow irradiated lines and appropriate SiO2 capping layers was used to obtain films that do not dewet when fully melted. Detailed processing maps were generated for Au and Ni, while equivalent trends for Cu and Cr were also noted. These systems were analyzed for common behaviors. These behaviors have been generalized into a basic process map that may apply more generally. Experimental parameters and sample preparation criteria are presented to realize such resolidification studies in other metal systems.


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Item Type: University of Pittsburgh ETD
Status: Unpublished
CreatorsEmailPitt UsernameORCID
Kline, James Ericjek16@pitt.eduJEK16
ETD Committee:
TitleMemberEmail AddressPitt UsernameORCID
Committee ChairLeonard,
Committee MemberBarnard, Johnjbarnard@engr.pitt.eduJBARNARD
Committee MemberWiezorek, Jorg M.Kwiezorek@pitt.eduWIEZOREK
Committee MemberChen, Kevinkchen@engr.pitt.eduPEC9
Date: 13 October 2005
Date Type: Completion
Defense Date: 28 June 2005
Approval Date: 13 October 2005
Submission Date: 9 July 2005
Access Restriction: No restriction; Release the ETD for access worldwide immediately.
Institution: University of Pittsburgh
Schools and Programs: Swanson School of Engineering > Materials Science and Engineering
Degree: MSMSE - Master of Science in Materials Science and Engineering
Thesis Type: Master's Thesis
Refereed: Yes
Uncontrolled Keywords: Au; Cr; Cu; dewetting; encapsulation; excimer laser; laser processing; metal thin films; Ni; SiO2
Other ID:, etd-07092005-125416
Date Deposited: 10 Nov 2011 19:50
Last Modified: 15 Nov 2016 13:45


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