Chen, Rimei and Vishnubhotla, Sai Bharadwaj and Khanal, Subarna R. and Jacobs, Tevis D. B. and Martini, Ashlie
(2020)
Quantifying the Pressure-dependence of Work of Adhesion in Silicon-Diamond Contacts.
Applied Physics Letters, 116 (5).
051602.
ISSN 1077-3118
Abstract
Continuum mechanics models for contacting surfaces assume a constant interfacial energy, or work of adhesion, between materials. Recent studies have challenged this assumption, instead demonstrating that stress-dependent chemical reactions across the interface modify the work of adhesion. Here, we perform 77 adhesion tests on diamond-silicon contacts using in situ TEM and atomistic simulations to quantify how the adhesion changes as a function of applied pressure. The results show a 7-fold increase in work of adhesion (from approximately 1 to 7 J/m2) with an increase in mean applied pressure from 0 to 11 GPa, where the most significant increase occurs above 5 GPa. We rule out alternative explanations for the changing work of adhesion, such as electron-beam artifacts, bulk shape change by inelastic deformation, and time-dependent processes such as creep. Therefore, these results confirm the presence of stress-driven chemical reactions in the contact and quantify the resulting change in adhesion of these materials with applied pressure.
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