Shao, L and Lin, Y and Swadener, JG and Lee, JK and Jia, QX and Wang, YQ and Nastasi, M and Thompson, PE and Theodore, ND and Alford, TL and Mayer, JW and Chen, P and Lau, SS
(2005)
Strain-facilitated process for the lift-off of a Si layer of less than 20 nm thickness.
Applied Physics Letters, 87 (25).
1 - 3.
ISSN 0003-6951
Abstract
We report a process for the lift-off of an ultrathin Si layer. By plasma hydrogenation of a molecular-beam-epitaxy-grown heterostructure of SiSb-doped-SiSi, ultrashallow cracking is controlled to occur at the depth of the Sb-doped layer. Prior to hydrogenation, an oxygen plasma treatment is used to induce the formation of a thin oxide layer on the surface of the heterostructure. Chemical etching of the surface oxide layer after hydrogenation further thins the thickness of the separated Si layer to be only 15 nm. Mechanisms of hydrogen trapping and strain-facilitated cracking are discussed. © 2005 American Institute of Physics.
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Item Type: |
Article
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Status: |
Published |
Creators/Authors: |
Creators | Email | Pitt Username | ORCID  |
---|
Shao, L | | | | Lin, Y | | | | Swadener, JG | | | | Lee, JK | jul37@pitt.edu | JUL37 | 0000-0002-7778-7679 | Jia, QX | | | | Wang, YQ | | | | Nastasi, M | | | | Thompson, PE | | | | Theodore, ND | | | | Alford, TL | | | | Mayer, JW | | | | Chen, P | | | | Lau, SS | | | |
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Centers: |
Other Centers, Institutes, Offices, or Units > Petersen Institute of NanoScience and Engineering |
Date: |
27 December 2005 |
Date Type: |
Publication |
Journal or Publication Title: |
Applied Physics Letters |
Volume: |
87 |
Number: |
25 |
Page Range: |
1 - 3 |
DOI or Unique Handle: |
10.1063/1.2146211 |
Schools and Programs: |
Swanson School of Engineering > Mechanical Engineering and Materials Science |
Refereed: |
Yes |
ISSN: |
0003-6951 |
Date Deposited: |
19 Nov 2014 20:17 |
Last Modified: |
05 Feb 2019 19:55 |
URI: |
http://d-scholarship.pitt.edu/id/eprint/23555 |
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